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  • 2025 AI Technology Innovation Forum

    Apr 15, 2025丨Room M50 (2nd floor) in Hall N5, SNIEC

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    • 2025 AI Technology Innovation Forum

    • Agenda

    2025 AI Technology Innovation Forum

    • Forum Date

      Apr 15, 2025

    • Forum Venue

      Room M50 (2nd floor) in Hall N5, SNIEC

    • Organizer

      Semiconductor Industry Observation

      Messe Muenchen Shanghai Co., Ltd.


    ai.jpg

    Agenda

      • Time

      • Presentation

      • Speaker

      • 9:00-12:00

      • 9:00-9:55

      • sign in

      • 09:55-10:20

      • Challenges and Opportunities in Analog and Custom Circuit Design in the AI Era

      • Primarius Technologies Co., Ltd

      • 10:20-10:45

      • CStorage Opportunities in AI Computing Terminals

      • GigaDevice Semiconductor Inc

      • 10:45-11:10

      • New Opportunities in GPGPU Triggered by DeepSeek


      • Suzhou Sumicro Electronics Technology Co., Ltd

      • 11:10-11:35

      • Infineon's High Energy Efficiency Solutions for AI Power Supplies

      • Ryan Zhou, Senior Marketing Manager, Consumer, Computing & Communication, Infineon Technologies Greater China

      • 11:35-12:00

      • Integrated Solution for Training and Inference of Edge-side AI

      • YEESTOR Microelectronics Co., Ltd

      • 12:00-13:30

      • Raffle & Lunch break

      • 13:30-13:55

      • Industrial collaboration promotes RISC-V to reach new heights. 

      • DAMO Academy

      • 13:55-14:20

      • AOS's High-performance Solutions for AI Power Supplies

      • Alpha & Omega Semiconductor (Shenzhen), Ltd

      • 14:20-14:45

      • New trends, new transformations,and new developments of edge AI.

      • Shanghai Guangyu Xinchen Technology Co., Ltd

      • 14:45-15:10

      • From the Explosion of AI Computing Power to the Graphics Revolution: How to Reconstruct the Performance Balance Formula for Embedded Devices

      • Imagination Technologies

      • 15:10-15:35

      • The Sentiment of "Made in China" in Overseas Cloud Computing and AI Applications

      • Hong Kong Inspur Cloud Service Co., Ltd

      • 15:35-16:00

      • Discussion on high thermally conductive filler solutions

      • LU CHENG, R&D Director, Shanghai Bestry Performance Materials Co.,Ltd

      • 16:00-16:30

      • Highly-accurate, AI-enabled fault monitoring for real-time control systems

      • Leo Wu, Field Application Engineer, Texas Instruments

      • 16:30-17:00

      • Industry dialogue

      • The agenda of conference shall be subject to the announcement on that day.

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